After the Samsung Galaxy Mini S4 last week, the Korean manufacturer today unveils another variant of its flagship smartphone: the Galaxy S4 Active. As expected, there is indeed a waterproof model and dust resistant.
As the days go by, we wonder if that’s okay to present Samsung in its press event on 20 June in London.After S4 Galaxy Mini formalized last week, the Korean manufacturer has just lifted the veil on another smartphone that has seen many leaks lately: Active Galaxy S4.Difficult to speak of surprise since most of the information that has circulated “under the cloak” are now proving accurate. Key features of the device:
• A 5 inch LCD Full HD (1920 x 1080 pixels)
• A quad core Qualcomm Snapdragon chipset clocked at 1.9 GHz 600
• 2 GB of RAM
• An 8-megapixel camera sensor
• A battery of 2600 mAh
• Jelly Bean Android 4.2.2 + interface TouchWiz UX Nature 2
• The dimensions of 139.7 x 71.3 x 9.1 mm, 151 g for
• The IP67
Note that compared to the original Galaxy S4, the newcomer still displays some notable differences. Thus, it turns out a little heavier and a little thicker than its predecessor. This fact is probably to make the assets of the iP67 certification which guarantees the smartphone protection against water and dust. And we’re not talking just splashing, but a dip of up to 30 minutes in one meter of water. The manufacturer has added a orking Aqua mode for the photo function, to improve decision underwater view. For the rest, we also find that the camera sensor and display technology are not at that offers the S4. The design is a bit different, especially with regard to the buttons on the front that turns lifts on new Active S4. This is good news for their handling in the water!
Samsung has confirmed that the device will be available for sale later in the summer, gray version, blue and orange. However, it has not brought more details about the price of Active S4. But we all know as the United States and Sweden will be the first two countries concerned by the commercialization of this waterproof model.
